SciHub
文献互助
期刊查询
一搜即达
科研导航
交流社区
登录
注册
发布
文献
求助
首页
我的求助
捐赠本站
lfl
Lv5
2
840 积分
2024-02-21 加入
最近求助
最近应助
互助留言
Molecular dynamics simulation of thermal welding process of Ag nanoparticles
2小时前
已完结
Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
3天前
已完结
Effects of Different Zinc Content on Solidification, Microstructure, and Mechanical Properties in Tin–Bismuth Alloy
5天前
已完结
The Variations of Electron and Phonon Contributions to the Thermal Conductivity with Temperature in the Sn–Bi–In–Zn Alternative Lead-Free Solder Alloys
5天前
已完结
On the Design of Sn-Bi-Ag-In and Sn-Bi-Ag-Zn Low-Temperature Pb-Free Solders Using High-Throughput CALPHAD Modeling and Key Experiments
5天前
已完结
Soldering to Gold Thin Films Using Indium Rich Silver Eutectic Alloys
7天前
已完结
Study of mechanical properties of indium-based solder alloys for cryogenic applications
8天前
已完结
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
8天前
已完结
Development of the Third-generation Semiconductor Interconnect Materials and Progress of Low-temperature Sintering of Copper Nanoparticles
8天前
已完结
Study of mechanical properties of indium-based solder alloys for cryogenic applications
9天前
已完结
没有进行任何应助
感谢
2小时前
感谢
3天前
感谢
5天前
感谢
6天前
感谢
8天前
感谢
8天前
感谢
8天前
感谢
8天前
感谢
9天前
感谢
10天前
最近帖子
最近评论
没有发布任何帖子
没有发布任何评论