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30 积分 2023-10-09 加入
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
1天前
已完结
Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices
6天前
已完结
Suspended-ultrathin Si membrane on SOI: a novel structure to reduce thermal stress of GaN epilayer
1个月前
已完结
Interface Engineering of 2D Materials toward High‐Temperature Electronic Devices
1个月前
已完结
Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management
3个月前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
3个月前
已完结
Hydrophilic Bonding of GaN and Diamond Substrates
3个月前
已关闭
Demonstration of high thermal performance GaN-on-graphite composite bonded substrate for application in III-V nitride electronics
3个月前
已完结
Demonstration of high thermal performance GaN-on-graphite composite bonded substrate for application in III-V nitride electronics
3个月前
已完结
(Ultra)wide bandgap semiconductor heterostructures for electronics cooling
4个月前
已完结
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