Lv3
330 积分 2024-07-16 加入
Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis
2个月前
已完结
开发一种新的铜腐蚀筛选方法在微电子中的应用
2个月前
已关闭
叠加超声对铜机械性能的影响
2个月前
已完结
微电子学中超声波引线键合的微接触方法
2个月前
已完结
Thermal contraction of arc discharge in mixtures of inert gases: Special features
2个月前
已完结
Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad
2个月前
已完结
Melting of a Wire Anode Followed by Solidification: A Three-Phase Moving Interface Problem
2个月前
已完结
A three-dimensional sharp interface model for self-consistent keyhole and weld pool dynamics in deep penetration laser welding
2个月前
已完结
The effects of aged Cu-Al intermetallics to electrical resistance in microelectronics packaging
2个月前
已完结
引线键合的数值研究 - 引线和焊盘之间的界面变形分析
2个月前
已完结
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