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10 积分 2024-10-30 加入
A novel model for through-silicon via (TSV) filling process simulation considering three additives and current density effect
2天前
已完结
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives
2天前
已完结
Bromide Ion as a Leveler for High-Speed TSV Filling
2天前
已完结
The key role of suppressor diffusion in defect-free filling of the through-silicon-via with high depth
3天前
已完结
Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias
3天前
已完结
Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
3天前
已完结
Research progress of additives for electroplating copper in high-end electronic manufacturing
7天前
已完结
Study of 5-Alkynylpyrimidines as Cobalt Superfilling Inhibitors
7天前
已完结
Foveation Control of a Robotic Eye Using Deep Reinforcement Learning
9天前
已完结
Development of a Two-Dimensional Model of the Human Arm to Investigate the Biomimetic Substitution of Human Bicep Muscle With a Dielectric Electroactive Polymer Muscle Actuator
10天前
已完结
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