Lv41
460 积分 2023-03-11 加入
Microstructural characterization of chemically vapor deposited TiN coating
2小时前
已完结
Electroplated Cu Bump with Ultra-Large Grain without Thermal Annealing and Kirkendall Void at the Interface of Cu/Sn Joint
1个月前
已完结
Effects of electric current on solid state phase transformations in metals
2个月前
已完结
Strong phonon softening and avoided crossing in aliovalence-doped heavy-band thermoelectrics
3个月前
已完结
Kinetics of interfacial reaction in bimetallic CuSn thin films
3个月前
已完结
Liquid-solid interfacial reaction between Sn3.8Ag0.7Cu solder and electrodeposited Fe-Ni alloys
3个月前
已完结
Effect of (111) oriented nanotwinned Cu substrate on the electromigration of Sn58Bi solder joint at high current density
4个月前
已完结
Fabrication of Pb-Free Sn-Bi Solder Using Polyoxyethylene Lauryl Ether
5个月前
已完结
Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys
5个月前
已完结
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