可靠性(半导体)
可靠性工程
外推法
加速度
产品(数学)
考试(生物学)
计算机科学
试验方法
压力(语言学)
工程类
数学
哲学
语言学
生物
量子力学
经典力学
几何学
物理
统计
功率(物理)
古生物学
数学分析
作者
Hong Wang,Yuxin Wang,Qiang Sun
标识
DOI:10.1109/srse59585.2023.10336099
摘要
Reliability growth test under normal stress (simulating the stress of a product under actual use conditions) requires a long test cycle, also consumes many human and material resources, and its application in engineering is limited. In order to realize the rapid growth of electronic product reliability, the accelerated reliability growth test is proposed to correct the failure in the test in time, and make the product reliability level improve continuously by test-improvement-test again-improvement again. In this paper, the quantitative evaluation of reliability accelerated growth test is realized by the correlation extrapolation of the multi-stress integrated acceleration factor and reliability growth model under normal stress, and it is applied in the engineering development of electronic products.
科研通智能强力驱动
Strongly Powered by AbleSci AI