导电体
导电油墨
铜
材料科学
墨水池
纳米颗粒
电阻率和电导率
纳米技术
金属
印刷电子产品
印刷电路板
喷墨打印
制作
化学工程
薄板电阻
电极
3D打印
复合材料
冶金
电气工程
工程类
图层(电子)
作者
Bong Soo Park,Dongjo Kim,Sunho Jeong,Jooho Moon,Jang Kyo Kim
标识
DOI:10.1016/j.tsf.2006.11.142
摘要
Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.
科研通智能强力驱动
Strongly Powered by AbleSci AI