原子层沉积
封装(网络)
材料科学
纳米技术
缓冲器(光纤)
相容性(地球化学)
图层(电子)
计算机科学
工程物理
工程类
电信
复合材料
计算机网络
作者
Yujing Zhang,Yifan Yang,Manala Tabu Mbumba,Muhammad Waleed Akram,Eric Rop,Luyun Bai,Mina Guli
出处
期刊:Solar RRL
[Wiley]
日期:2022-10-22
卷期号:6 (12)
被引量:18
标识
DOI:10.1002/solr.202200823
摘要
Organic–inorganic mixed perovskite solar cells (PSCs) have been rapidly developed. However, while efficiency is improved, stability is still a problem that hinders further commercial production. Researchers have adopted many solutions and technological means to solve this problem, such as additive engineering, interface engineering, encapsulation engineering, and so on. To achieve the goal, various technical means have been employed. Among them, atomic layer deposition (ALD) is an effective tool to prepare compact pinhole‐free thin films at low temperature, and its introduction provides some solutions to improve the stability of devices. Herein, the typical cases reported in recent years of preparing PSCs buffer and encapsulation layers using ALD technology to improve device stability are reported. The specific role of ALD in this process is analyzed, and the prospects and challenges of its further application are also discussed prospectively.
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