Organic–inorganic mixed perovskite solar cells (PSCs) have been rapidly developed. However, while efficiency is improved, stability is still a problem that hinders further commercial production. Researchers have adopted many solutions and technological means to solve this problem, such as additive engineering, interface engineering, encapsulation engineering, and so on. To achieve the goal, various technical means have been employed. Among them, atomic layer deposition (ALD) is an effective tool to prepare compact pinhole‐free thin films at low temperature, and its introduction provides some solutions to improve the stability of devices. Herein, the typical cases reported in recent years of preparing PSCs buffer and encapsulation layers using ALD technology to improve device stability are reported. The specific role of ALD in this process is analyzed, and the prospects and challenges of its further application are also discussed prospectively.