材料科学
电化学
降级(电信)
离子
湿度
故障率
复合材料
热力学
电子工程
化学
可靠性工程
电极
工程类
物理
物理化学
有机化学
作者
Shuang Yang,A. Christou
出处
期刊:IEEE Transactions on Device and Materials Reliability
[Institute of Electrical and Electronics Engineers]
日期:2007-03-01
卷期号:7 (1): 188-196
被引量:65
标识
DOI:10.1109/tdmr.2007.891531
摘要
A new model for silver electrochemical migration is presented, which includes the insulation resistance degradation prior to dendritic growth. This failure model reported is based on the calculation of the ion accumulation rate. Failure occurs when the accumulated ion concentration exceeds the threshold. Experimental measurements have been carried out to validate the model. Experiments under various temperature-humidity-bias conditions are reported.
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