A novel glycidyl ether type tetrafunctional epoxy resin: synthesis, cure kinetic and properties

Thermal stable epoxy is indispensable for aerospace and advanced electronic application. As replacements for common thermal stable epoxy TGDDM, we previously developed several glycidyl ether type tetrafunctional epoxies. As a continuous effort to achieve higher Tg, a novel tetrafunctional epoxy with shorter spacer and lower epoxide equivalent weight (TFEP) was synthesized. TFEP was mixed with DGEBA, and cured with MHHPA and DDS, respectively. TFEP increases the Tg and char residues, and reduces the maximum weight loss rate. Tg of 30 wt%TFEP/DGEBA/DDS is higher than that of previously reported epoxies, whereas Tg of 40 wt%TFEP/DGEBA/DDS is comparable to that of TGDDM/DDS. The influences of TFEP on the Td, strength, toughness, water absorption and free volume are different, depending on the curing agents. Moreover, 30 wt%TFEP/DGEBA/DDS exhibits higher toughness and Td5%, lower water absorption, and comparable strength, compared with TGDDM/DDS, providing a better replacement for TGDDM. Besides, TFEP slightly increases the Ea.