数码产品
热阻
热的
热流密度
材料科学
高温
电子设备冷却
工程物理
机械工程
传热
核工程
环境科学
热力学
电气工程
工程类
物理
复合材料
作者
Murat Bulut,Satish G. Kandlikar,Nedim Sözbir
标识
DOI:10.1080/01457632.2018.1480868
摘要
Future developments in electronic industries will require efficient cooling systems to dissipate large amount of heat produced over a small area. In recent years, interest has grown in extending the use of vapor chambers to high heat flux electronics cooling because of their low thermal resistance values and uniform temperature distribution abilities. A detailed overview of vapor chambers is presented in this paper including their principle of operation, types of performance characteristics, and various applications. Recent developments in improving the thermal performance of vapor chambers are also presented in this article.
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