铜
化学吸附
化学
硫醇
无机化学
氧化还原
氧化物
图层(电子)
吸附
有机化学
作者
Harald Keller,P. Šimák,W. Schrepp,J. Dembowski
标识
DOI:10.1016/0040-6090(94)90574-6
摘要
Investigations on the surface chemistry of the self-assembly process (chemisorption) of thiols on copper are reported. The chemisorption was investigated on copper sheets and on copper powder. Copper exposed to air is covered qith a thin oxide layer. On contact with thiols the oxidic copper species are transformed to copper thiolates by a redox raction. Cu2+ is reduced to Cu+ and thiol (HSR) is oxidized to disulphide (RS-SR). Excess thiol forms copper thiolate complexes which build up self-assembled multilayers with layer thicknesses of 20–90 nm. The self-assembled thiolate layers cause a strong hydrophobization of the copper surface.
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