计算机科学
三维集成电路
静态随机存取存储器
计算机体系结构
电阻随机存取存储器
CMOS芯片
物理设计
集成电路设计
嵌入式系统
炸薯条
电子工程
电气工程
工程类
电路设计
计算机硬件
电信
电压
作者
Gauthaman Murali,Sung Kyu Lim
标识
DOI:10.23919/date51398.2021.9474057
摘要
One of the advantages of 3D IC technology is its ability to integrate different devices such as CMOS, SRAM, and RRAM, or multiple technology nodes of single or different devices onto a single chip due to the presence of multiple tiers. This ability to create heterogeneous 3D ICs finds a wide range of applications, from improving processor performance by integrating better memory technologies to building compute-in-memory ICs to support advanced machine learning algorithms. This paper discusses the current trends and future directions for the physical design of heterogeneous 3D ICs. We summarize various physical design and optimization flows, integration techniques, and existing academic works on heterogeneous 3D ICs.
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