材料科学
微观结构
维氏硬度试验
纳米复合材料
粒度
铜
冶金
原位
晶粒生长
纳米颗粒
同种类的
电阻率和电导率
复合材料
纳米技术
化学
有机化学
工程类
物理
电气工程
热力学
作者
Xiaojing Li,Peng Hu,Jinshu Wang,Shuqun Chen,Wenyuan Zhou
标识
DOI:10.1016/j.jallcom.2020.156958
摘要
In this work, a one-step thermal plasma synthesis route was developed to construct core-shell W-Cu nanoparticles with size about 30 nm. As synthesized nanocomposite powders address the issues of homogeneous elemental distribution and short diffusion distance for Cu to form network around W grains, facilitating fast densification with uniform microstructure and suppressed W grain growth. As a result, compact with high relative density of 99.31% and grain size of 260 nm was obtained at low temperature of 1100 °C, further led to the recorded hardness of 562 Vickers-hardness (Hv) and electrical conductivity of 54.32% International Annealed Copper Standard (IACS), respectively.
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