Optimal Arrangements of Inlet and Outlet in Topology Liquid-Cooled Microchannel Heat Sink Based on Multi-Objective Optimization

Different forms of inlet and outlet arrangements in microchannel heat sink have a significant impact on the efficient heat dissipation. In this paper, under the framework of the finite element method coupled with the Method of Moving Asymptotes (MMA), three novel topology structures are proposed. Using Solid Isotropic Material with Penalization Parametrization (SIMP), the topology results with different inlet and outlet arrangements are compared and analyzed, with minimizing the average solid temperature, maximizing the heat transfer capacity and minimizing the power consumption per unit of heat transfer, and 207 sets of results are obtained. The optimized results were analyzed by the Nusselt number (Nu), the friction factor (f) and the Performance Evaluation Criterion (PEC). And the results present that the heat transfer performance of the optimed three arrangements in the 207 arrangements are enhanced by 133.6%, 112.56% and 135.79%, respectively, and the PECs improve up to 73.55%, 65.54% and 79.78%, respectively, compared with the horizontal inlet and outlet liquid-cooled plate type microchannel heat sink. And the results of the present work provide a reference for the optimal design of electronic heat sinks under different working conditions.