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890 积分 2023-02-13 加入
Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints
5天前
已完结
Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
5天前
已完结
Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
25天前
已完结
Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints
25天前
已完结
Research on Reliability Accelerated Growth Test and Evaluation Method of Electronic Product
1个月前
已完结
Finite Element Investigation Into the Mechanical Effects of Solder Voids on the Performance of Stacked-Tape REBCO Conductors
1个月前
已完结
Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations
2个月前
已完结
Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering
2个月前
已完结
Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles
2个月前
已完结
Piezoelectric Ceramics and Flexible Printed Circuits’ Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly
2个月前
已完结
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