Lv3
300 积分 2022-10-24 加入
Atomic-Scale Surface Engineering for Giant Thermal Transport Enhancement Across 2D/3D van der Waals Interfaces
2天前
已完结
Analytical Solution for Temperature Rise in Complex Multilayer Structures With Discrete Heat Sources
7天前
已完结
Variations of Acoustic and Diffuse Mismatch Models in Predicting Thermal-Boundary Resistance
11天前
已完结
P‐3: Effect of Light Shielding Metal on the Performance of a‐IGZO TFTs with a Self‐Aligned Top‐Gate Structure
14天前
已完结
Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications
1个月前
已完结
Application of the Kirchhoff Transform to Thermal Spreading Problems With Convection Boundary Conditions
1个月前
已完结
Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance
1个月前
已完结
Large “near junction” thermal resistance reduction in electronics by interface nanoengineering
1个月前
已完结
Cooling Limits for GaN HEMT Technology
1个月前
已完结
Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications
1个月前
已完结
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