Lv2
160 积分 2020-10-24 加入
Mechanisms involved in HBr and Ar cure plasma treatments applied to 193 nm photoresists
2小时前
待确认
Plasma etch solutions for EUV patterning: defect challenges
2个月前
已完结
Plasma etch solutions for EUV patterning: defect challenges
2个月前
已关闭
Plasma atomic layer etching for titanium nitride at low temperatures
3个月前
已完结
TiN Etching and Its Effects on Tungsten Etching in SF6/Ar Helicon Plasma
3个月前
已完结
NVDRAM: A 32Gb Dual Layer 3D Stacked Non-volatile Ferroelectric Memory with Near-DRAM Performance for Demanding AI Workloads
5个月前
已完结
Pitch Walking Simulation and Process Window Evaluation of Self Aligned Quadruple Patterning for Advanced Nodes
1年前
已完结
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
1年前
已完结
Thermal Atomic Layer Etching of CoO, ZnO, Fe2O3, and NiO by Chlorination and Ligand Addition Using SO2Cl2 and Tetramethylethylenediamine
1年前
已完结
Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices
2年前
已关闭
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