Lv1
40 积分 2023-08-03 加入
Pitch Walking Simulation and Process Window Evaluation of Self Aligned Quadruple Patterning for Advanced Nodes
12小时前
已完结
Dry etching in the presence of physisorption of neutrals at lower temperatures
8个月前
已完结
SiO2 Tapered Etching Employing Magnetron Discharge of Fluorocarbon Gas
8个月前
已完结
Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower Carbon Footprint for Memory Channel Hole of 3D NAND Flash over 400 Layers
8个月前
已完结
High‐aspect‐ratio oxide etching using CF4/C6F12O plasma in an inductively coupled plasma etching system with low‐frequency bias power
8个月前
已完结
A Precise Wafer Thinning Integration Process for nano-TSV Formation
8个月前
已完结
Etching scallop-less nano-TSV with F/O coupling plasma
8个月前
已完结
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing
8个月前
已完结
Fin-shape Optimization for Single Diffusion Break Device Performance in FinFET Technology
10个月前
已完结
Single and Double Diffusion Breaks in 14nm FinFET and Beyond
10个月前
已完结
皖公网安备34019202002308
