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10 积分 2024-07-10 加入
Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
6个月前
已完结
Metallic conductivity via CoCu filler-Co nanocatalyst bridge for a novel thermoset paste
6个月前
已完结
Development of a curable conductive copper paste in air
6个月前
已完结
The rise of conductive copper inks: challenges and perspectives
6个月前
已完结
Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air
6个月前
已完结
Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads: Effect of pre-treatment with the disperse medium
6个月前
已完结
Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles
6个月前
已完结
Copper interconnections and antennas fabricated by hot-pressing printed copper formate
6个月前
已完结
Interfacial diffusion behavior and properties of hot-pressed Kovar/Cu composites
6个月前
已完结
Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics
7个月前
已完结
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