Lv11
40 积分 2024-04-08 加入
Superconformal Bottom-up Cobalt Deposition in High Aspect Ratio through Silicon Vias
1小时前
已完结
5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies
1个月前
已完结
The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board
1个月前
已完结
Benzyl-containing quaternary ammonium salt as a new leveler for microvia copper electroplating
1个月前
已完结
Insight into Aqueous Electrolyte Additives: Unraveling Functional Principles, Electrochemical Performance, and Beyond
1个月前
已完结
Electrochemical Behavior and Analysis of Organic Additives in Cobalt Damascene Baths
3个月前
已关闭
Damascene copper electroplating for chip interconnections
4个月前
已关闭
Design Challenges of Intrachiplet and Interchiplet Interconnection
4个月前
已完结
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
4个月前
已完结
Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study
4个月前
已完结
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