Lv11
40 积分 2023-08-18 加入
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
5小时前
已完结
Novel Pre-Applied Underfill Material Designed for Collective Bonding Process
10天前
已完结
Highly transparent silanized cellulose aerogels for boosting energy efficiency of glazing in buildings
1个月前
已完结
Controlled cationic curing of epoxy composites with photochemically modified silanol encapsulated carbon black
1个月前
已完结
Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging
2个月前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
2个月前
已完结
Parametric Study on the Void Risk in FC-POP Molded Underfill Process Using a Novel Porous Media, Two-Phase, Compressible Flow Simulation Method
2个月前
已完结
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
3个月前
已完结
Effect of the Coupling Agent (3-Aminopropyl) Triethoxysilane on the Structure and Fire Behavior of Solvent-Free One-Pot Synthesized Silica-Epoxy Nanocomposites
4个月前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
4个月前
已完结
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