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338 积分 2021-07-03 加入
Nanostructured Materials: Processing, Properties and Applications
4天前
已完结
Buckling Behavior and Effective Width Design Method for Thin Plates with Holes under Stress Gradient
1个月前
已完结
Warping model of high-power IGBT modules subjected to reflow soldering process
4个月前
已完结
Single Side Direct Cooling SiC Module Baseplate Warpage Behavior and Solutions
5个月前
已完结
Better Warpage Control by Using Low Temperature Solder for Large FCBGA Application
5个月前
已完结
CTE-Tailorable Copper Heat Spreaders, Heat Sinks, and Heat Pipes via a nanoCopper Approach
5个月前
已完结
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging
5个月前
已完结
On the enhancement of natural convection heat transfer with multi-branching fins
5个月前
已完结
Heat transfer augmentation of natural convection heat sink through notched fin design
5个月前
已完结
EXPERIMENTAL INVESTIGATION ON TWO-PHASE HEAT AND FLUID FLOW IN POROUS HEAT SINKS
5个月前
已完结
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