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40 积分 2024-11-08 加入
Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C
1天前
已完结
Advanced sustainable triboelectric nanogenerators for biomedical and clinical applications: In vivo treatments, in vitro therapeutics, and assisted rehabilitations
3天前
已完结
Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules
19天前
已完结
Topology optimization for thermal stress reduction in power semiconductor module
24天前
已完结
Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint
1个月前
已完结
Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects
1个月前
已完结
Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging
1个月前
已完结
Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage
1个月前
已完结
Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules
2个月前
已完结
A Double-Sided Cooling approach of Discrete SiC MOSFET Device Based on Press-Pack Package
2个月前
已完结
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