Lv11
60 积分 2024-11-08 加入
Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium
1小时前
待确认
A study on μBGA solder joints reliability using lead-free solder materials
3天前
已完结
Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices
8天前
已完结
Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering
14天前
已完结
Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy
14天前
已完结
皖公网安备34019202002308
