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8 积分 2022-01-24 加入
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
2个月前
已完结
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging
2个月前
已完结
Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles
2个月前
已完结
Formation of Wavy Crack in Double-Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing
2个月前
已完结
Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions
2个月前
已完结
Unlocking the Trade-off Between Intrinsic and Interfacial Thermal Transport of Boron Nitride Nanosheets by Surface Functionalization for Advanced Thermal Interface Materials
4个月前
已完结
design of soft/hard interface with high adhesion energy and low inerfacial thermal resistance via regulation of interfacial hydrogen bonding interaction
9个月前
已完结
Effect of BN size on AC breakdown performances of PTFE/BN composites
11个月前
已完结
Polymer composite with enhanced thermal conductivity and mechanical strength through orientation manipulating of BN
1年前
已完结
Synthesis of Copper and Copper-Ruthenium Nanoparticles in Ionic Liquids for the Metallization of Advanced Interconnect Structures
1年前
已完结
The influence of weakly $S\Phi$-supplemented subgroups on the structure of finite groups
微纤化纤维素纤维形态的几种测量方法
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