Lv2
118 积分 2020-10-03 加入
Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology
2天前
已完结
Combined laser cutting process for interior holes in thick glasses
5天前
已完结
Fabrication of a novel high electrical conductivity Si3N4 matrix composite with Cu three-dimensional network structure by spark plasma sintering
1个月前
已完结
Laser processing of alumina ceramic by a spatially superposing millisecond laser and a nanosecond laser with different beam shapes
9个月前
已完结
Experimental and theoretical investigation of the drilling of alumina ceramic using Nd:YAG pulsed laser
11个月前
已完结
Two-dimensional transient modeling of CO2 laser drilling of microvias in high density flip chip substrates
1年前
已完结
Fabrication of 4H–SiC microvias using a femtosecond laser assisted by a protective layer
1年前
已完结
First-principles predictions of thermal conductivity of bulk diamond under isotropic and uniaxial (100) strains
1年前
已完结
Two-dimensional transient modeling of CO2 laser drilling of microvias in high density flip chip substrates
1年前
已完结
Process strategies for laser cutting of electrodes in lithium-ion battery production
1年前
已完结
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