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60 积分 2021-06-20 加入
Plastic ball grid array (PBGA) overview
2个月前
已完结
一种高可靠性的嵌入式SiC功率器件封装设计方法
2个月前
已完结
Design and Evaluation of a Face-Down Embedded SiC Power Module With Low Parasitic Inductance and Low Thermal Resistance
2个月前
已完结
Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module
5个月前
已完结
A 48 V, 300 kHz, High Current DC/DC-Converter Based on Paralleled, Asymmetrical & Thermally Optimized PCB Embedded GaN Packages with Integrated Temperature Sensor
7个月前
已完结
Top side isolation investigation of PCB embedded 1.2kV dies
7个月前
已完结
Thermomechanical analysis of Si-chip fracture caused by double-sided Ag sintering for PCB embedded package
7个月前
已完结
Experimental investigation of PCB embedded 1200 V IGBT/diode power pre-package under high-humidity high-temperature reverse voltage bias
7个月前
已完结
Reliability Screening of a Hybrid DBC/PCB power semiconductor prepackage
7个月前
已完结
碳化硅功率器件用有机硅灌封胶材料耐温性能研究
7个月前
已完结
Experimental and theoretical investigations on Se(iv) and Se(vi) adsorption to UiO-66-based metal–organic frameworks
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