Lv11
40 积分 2023-02-01 加入
Modeling and Optimization of Thermal Cycling Performance to Reduce Ratcheting-Induced Passivation Cracking in High-Voltage Power Modules
6小时前
已完结
Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination
2个月前
已完结
A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
2个月前
已完结
Effect of EMC properties on the chip to package interaction (CPI) reliability of flip chip package
7个月前
已完结
Fatigue Crack Growth Analysis of Interface Between Lead Frame and Molding Compound
11个月前
已完结
Failure Mechanism Study for Flip Chip QFN Crack Issue under Temperature Cycling Test
1年前
已完结
Testing and Modeling of Board Level Reliability of WLCSP under UHAST Conditions
1年前
已完结
Aluminum Pad Plasticity-Related Bump Failure During Temperature Cycling
1年前
已完结
Study of Small Polyimide Open Size in Contact Resistance and Reliability For Flip Chip Cu Pillar Package
1年前
已完结
Design Study to Prevent Mold Delamination for Overmolded Lead Frame Package
1年前
已完结
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