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530 积分 2024-11-23 加入
Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles
13天前
已完结
Electronic and Photoelectronic Memristors Based on 2D Materials
17天前
已完结
Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves
27天前
已完结
Reliability of Sn–Ag–Sb lead-free solder joints
1个月前
已完结
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding
1个月前
已完结
Thermodynamic Modeling of the Bi–Ga–Zn System
1个月前
已关闭
Calorimetric and phase diagram studies of the Ga-In-Zn system
1个月前
已完结
Grain fragmentation in ultrasonic-assisted TIG weld of pure aluminum
1个月前
已完结
Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer
1个月前
已完结
Microstructure, hardness, and shear behavior of Sn3.0Ag0.5Cu–Sn58Bi composite solder joint
3个月前
已完结
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