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20 积分 2023-10-23 加入
A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology
1天前
已完结
Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding
2天前
已完结
0.5 μm Pitch Next Generation Hybrid Bonding with High Alignment Accuracy for 3D Integration
2天前
已关闭
Recent Advances and Trends in Cu–Cu Hybrid Bonding
2天前
已完结
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
2天前
已完结
The Development of an Ultra-Precision Motion Control System Based on a Master-Slave Mode
5天前
已关闭
Ultra-low frequency active vibration isolation in high precision equipment with electromagnetic suspension: Analysis and experiment
5天前
已完结
Ultra-low frequency active vibration isolation in high precision equipment with electromagnetic suspension: Analysis and experiment
5天前
已关闭
Ultra-low frequency active vibration isolation system with quasi-zero stiffness characteristic using self-tuning filter-based feedforward control
5天前
已完结
Design of Active Vibration Isolation Controller with Reduced Actuator Force Based on Robust $${\mathbf{\mathcal{H}}}_{\infty }$$ Control Theory
5天前
已完结
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