Lv11
68 积分 2024-08-16 加入
Physical Model and Characteristics of 3D NAND Memory Cell Metastability Issues under High Temperature Stress
5天前
已完结
Mechanical Stress Effects on Dielectric Leakage and Interconnection Integrity in 3D NAND Flash Memory
6天前
已完结
Mechanical Stress Distribution and the Effects of Process Parameter Changes in Vertical NAND Flash Memory
6天前
已完结
Impact of Residual Stress on a Polysilicon Channel in Scaled 3D NAND Flash Memory
1个月前
已完结
Impact of Mechanical Stress on the Electrical Performance of 3D NAND
1个月前
已完结
(Invited) 3D-NAND Reliability: Review of key mechanisms and mitigations
1个月前
已完结
Aspect ratio-dependent leaning of a block array in 3D NAND flash memory
1个月前
已完结
Mechanical stress in a tapered channel hole of 3D NAND flash memory
1个月前
已完结
Review of Semiconductor Flash Memory Devices for Material and Process Issues
1个月前
已完结
Review of Semiconductor Flash Memory Devices for Material and Process Issues (Adv. Mater. 43/2023)
1个月前
已完结
皖公网安备34019202002308
