Lv21
140 积分 2023-11-08 加入
Fully Self-Aligned Via Integration for Interconnect Scaling Beyond 3nm Node
1个月前
已完结
Semidamascene Interconnects for 2nm node and Beyond
1个月前
已完结
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
1个月前
已完结
Advanced BEOL Interconnects
1个月前
已完结
Breakthrough Design Technology Co-optimization using BSPDN and Standard Cell Variants for Maximizing Block-level PPA
1年前
已完结
Taking it to the street: advanced monitoring and 12-lead EKGs in prehospital care
1年前
已关闭
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
1年前
已完结
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