Lv11
22 积分 2024-08-10 加入
Low-temperature Thermal Shock Simulation and Life Aging Test of Indium Flip-chip Interconnection Using Liquid Helium for Superconducting Integrated Circuit Package
6小时前
待确认
Thermal Trends in Emerging Technologies
3个月前
已完结
The Analytical Model of Hotspot Temperature and the Effects of Different Factors in 3D Integration
4个月前
已完结
Prediction of hotspots on 3D packages due to joule heating in Through Silicon Vias (TSV)
4个月前
已关闭
Electro-Thermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects
4个月前
已完结
Electro-Thermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects
5个月前
已完结
Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application
5个月前
已完结
Intelligent Codesign Strategy for Thermal Management and Cost Control of 3-D Integrated System With TTSV
6个月前
已完结
Intelligent Design Method of Thermal Through Silicon via for Thermal Management of Chiplet-Based System
6个月前
已完结
A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System
7个月前
已完结
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