Lv11
10 积分 2024-07-26 加入
Thermomechanical Reliability and Constitutive Investigation of Copper Through-Glass Via in Glass Interposer
6小时前
已完结
The stress - strain behaviour of copper over a large strain range
12天前
已完结
Near-Perfect Elastoplasticity in Pure Nanocrystalline Copper
14天前
已完结
The interfacial reliability of through-glass vias for 2.5D integrated circuits
1个月前
已完结
Integrated chips: An interdisciplinary evolution in the Post-Moore Era
3个月前
已关闭
A Stable Cu Nanoparticles Used for Seed Layer Deposition of through Silicon Via
4个月前
已关闭
A ‘mesh’ seed layer for improved through-silicon-via fabrication
4个月前
已完结
(Invited) All-Wet TSV Fabrication Using Electroless Plated Barrier and Cu Seed Layers with Pd Nanoparticle Catalyst
4个月前
已关闭
Extremely-Compressed SSDs with I/O Behavior Prediction
4个月前
已完结
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
5个月前
已完结
Lead-Free Perovskite Tandem Solar Cells with Wide Bandgap Tin Perovskite and CIGS
6小时前
已采纳
Resolving Activation Entropy of CO Oxidation under the Solid–Gas and Solid–Liquid Conditions from Machine Learning Simulation
6小时前
已采纳
Micropore System of Terrestrial Clay-Rich Shale from Dongyuemiao Member of Jurassic Ziliujing Formation in the Fuxing Area, Eastern Sichuan Basin
6小时前
待审核
Mechanistic Insights into the Palladium-Catalyzed Perfluoroalkylative Carbonylation of Unactivated Alkenes to β-Perfluoroalkyl Esters: A DFT Study
5个月前
已采纳
皖公网安备34019202002308
