Lv11
10 积分 2024-07-26 加入
A Stable Cu Nanoparticles Used for Seed Layer Deposition of through Silicon Via
5小时前
求助中
A ‘mesh’ seed layer for improved through-silicon-via fabrication
6小时前
求助中
(Invited) All-Wet TSV Fabrication Using Electroless Plated Barrier and Cu Seed Layers with Pd Nanoparticle Catalyst
6小时前
求助中
Extremely-Compressed SSDs with I/O Behavior Prediction
16天前
已完结
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
29天前
已完结
A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
1个月前
已完结
Self-oscillating polymeric refrigerator with high energy efficiency
1个月前
已完结
Co-designing electronics with microfluidics for more sustainable cooling
1个月前
已完结
High-efficiency cooling via the monolithic integration of copper on electronic devices
1个月前
已完结
Mechanistic Insights into the Palladium-Catalyzed Perfluoroalkylative Carbonylation of Unactivated Alkenes to β-Perfluoroalkyl Esters: A DFT Study
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