Lv11
11 积分 2021-03-04 加入
Electrical Modeling and Performance Analysis of Cu and CNT based TSV-bump-RDL
3小时前
待确认
High-Frequency Transmission Characteristic Analysis of TSV-RDL Interconnects
3小时前
已完结
An A-$\Phi$ Formulation Solver in Electromagnetics Based on Discrete Exterior Calculus
7个月前
已完结
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
9个月前
已完结
A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling
1年前
已完结
Thermal contact conductance; theoretical considerations
1年前
已完结
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)
1年前
已完结
Nodal High-Order Methods on Unstructured Grids
1年前
已完结
A non-overlapping domain decomposition method with non-matching grids for modeling large finite antenna arrays
1年前
已完结
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