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sugar
Lv1
15 积分
2021-03-04 加入
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An A-$\Phi$ Formulation Solver in Electromagnetics Based on Discrete Exterior Calculus
2个月前
已完结
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
4个月前
已完结
A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling
8个月前
已完结
Transient electrical-thermal co-simulation in the design of on-chip and 3-D interconnects
8个月前
已关闭
Thermal contact conductance; theoretical considerations
8个月前
已完结
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)
8个月前
已完结
Nodal High-Order Methods on Unstructured Grids
9个月前
已完结
A non-overlapping domain decomposition method with non-matching grids for modeling large finite antenna arrays
9个月前
已完结
Skin effect and proximity effect analysis of stranded conductor based on mixed order MoM with adaptive cross approximation algorithm
9个月前
已完结
A Hybrid PEEC-SPICE Method with Curved Triangular Meshes for Coupled Circuit-Electromagnetic Simulation of PCB/Flex Circuit
11个月前
已完结
没有进行任何应助
谢谢
3年前
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