Lv11
100 积分 2024-02-29 加入
Physical Characteristics of Sintered Silver Nanoparticle Inks with Different Sizes during Furnace Sintering
1个月前
已关闭
The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis
1个月前
已关闭
Effect of sintering atmospheres on printed silver nanoparticle patterns for flexible electronics application
2个月前
已完结
Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink
2个月前
已完结
Low-resistance joints for YBCO-coated conductors with Ag nanoparticle paste
2个月前
已完结
Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging
2个月前
已完结
High-conductivity flexible Ag films formed by low-temperature and short-time sintering of PVP-modified silver oxalate composite ink
2个月前
已完结
Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag$$_{3}$$Sn-based materials, sintered by SPS in view of die-attachment applications
2个月前
已完结
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process
2个月前
已完结
Exploring the critical role of grinding modification on the flotation recovery of electrode materials from spent lithium ion batteries
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