Lv41
430 积分 2022-10-20 加入
Reliability and Benchmark of 2.5D Non-Molding and Molding Technologies
2小时前
已完结
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
1个月前
已完结
Statistical analysis of tin whisker growth
3个月前
已完结
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth
3个月前
已完结
High Density Multi-Chip Embedded Panel-Level Packaging Integration Technology
4个月前
已完结
Wafer level compression molding compounds
4个月前
已完结
Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
4个月前
已完结
Failure Analysis
4个月前
已完结
Thermal Modeling of 2.5D Integrated Package of CMOS Image Sensor and FPGA for Autonomous Driving
6个月前
已完结
Small Package Size Low Power CMOS Image Sensor using Two Different Type Small Through Silicon Vias Technology for 3D Packaging
6个月前
已完结
皖公网安备34019202002308
