Lv11
50 积分 2024-08-31 加入
Kinetics of Cu6Sn5 and Cu3Sn intermetallic compounds growth and isothermal solidification during Cu-Sn transient liquid phase sintering process
1个月前
已完结
A low cost multi-shapes designed sintering composite paste: A strengthening method of sintered interconnect for die attach in high temperature applications
2个月前
已完结
Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device
2个月前
已完结
Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation
2个月前
已完结
Effect of liquid metal enhanced Cu nano/micro particle paste on performance of Cu-Cu joints
2个月前
已完结
Effect of liquid metal enhanced Cu nano/micro particle paste on performance of Cu-Cu joints
2个月前
已完结
Transient liquid phase bonding of Sn–Bi solder with added Cu particles
3个月前
已关闭
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
3个月前
已完结
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