电缆密封套
波导管
材料科学
光纤
光学
基质(水族馆)
光电子学
计算机科学
电信
物理
海洋学
地质学
作者
Lars Brusberg,Jason R. Grenier,Jürgen Matthies,Allen R. Miller,Chad C. Terwilliger,Jeffrey W. Clark,Beibei Zeng,Pierre Beneke
标识
DOI:10.1109/ecoc52684.2021.9605856
摘要
Co-packaged optics require novel packaging concepts for high fiber counts and low-cost assembly. We design and fabricate a glass waveguide substrate with MPO interfaces that yield an average connector loss of 0.5 dB. Simulations are performed to assess the required spring force for physical contact.
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