Lv2
102 积分 2024-01-23 加入
Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow
20天前
已完结
Glass-Based Micro-Hotplate With Low Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow
20天前
已完结
A role of integrated microheaters in a microfluidics based point-of-care-testing and beyond for healthcare applications
20天前
已完结
Design, optimization, fabrication and analysis of Cu microheater for loop-mediated isothermal amplification (LAMP) applications
20天前
已完结
System in package embedding III-V chips by fan-out wafer-level packaging for RF applications
1个月前
已完结
Adhesion and Reliability Studies Of The Heterogeneous Integration of Conductive LSR And Other Components On SiP For Bio-Sensing Applications
1个月前
已完结
Patch-type Flex SiP Platform for Heathcare Application
1个月前
已完结
System and Package-Level EMI Shielding Effectiveness Analysis for AR/VR Devices
1个月前
已完结
Stretchable and conductive fibers fabricated by a continuous method for wearable devices
1个月前
已完结
Porous Conductive Textiles for Wearable Electronics
1个月前
已完结
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