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96 积分 2024-01-23 加入
Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables
2天前
已完结
Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing
3天前
已完结
2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages
3天前
已完结
MEMS gyro sensor using flexible substrate for package size reduction
10天前
已完结
Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)
10天前
已完结
Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables
15天前
已完结
New approaches to bonding thermoplastic and thermoset polymer composites
2个月前
已完结
Cooling chip on PCB by embedded active microchannel heat sink
4个月前
已完结
Glass-Embedded Fan-Out Antenna-in-Packaging for 5G Millimeter Wave Applications
4个月前
已完结
基于玻璃通孔的Ka波段宽带滤波封装天线
4个月前
已完结
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