Lv11
56 积分 2023-09-13 加入
A phase field model for failure in interconnect lines due to coupled diffusion mechanisms
14天前
已完结
Phase-Field Simulation of the Sintering Process of Ceramic Composite Fuel
16天前
已关闭
An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects
26天前
已完结
镁晶体塑性—相场法耦合全场模型及变形行为仿真研究
26天前
已完结
Phase field modeling of the effect of porosity on grain growth kinetics in polycrystalline ceramics
1个月前
已完结
Computer modeling and simulation of solid-state sintering: A phase field approach
1个月前
已完结
Effect of Reverse Currents during Electroplating on the ⟨111⟩-Oriented and Nanotwinned Columnar Grain Growth of Copper Films
1个月前
已完结
Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages
1个月前
已完结
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs
1个月前
已完结
Influence of height difference between chip and substrate on RDL in silicon-based fan-out package
1个月前
已关闭
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