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18 积分 2023-09-13 加入
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
1天前
已完结
Vibration and shock reliability of MEMS: modeling and experimental validation
2天前
已完结
Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
28天前
已完结
Interfacial Imc Growth Behavior of Sn-3ag-3sb-Xin Solder on Cu Substrate
28天前
已完结
Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
1个月前
已完结
Electromigration in metals
1个月前
已完结
A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
1个月前
已完结
Effect of the critical size of initial voids on stress-induced migration
3个月前
已完结
Recrystallization-induced void migration in electroplated Cu films
3个月前
已完结
Void growth in the early stages of aging and electromigration
3个月前
已完结
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