Lv2
196 积分 2022-10-28 加入
Microtrenching geometry of 6H–SiCplasmaetching
2个月前
已关闭
Adhesive wafer bonding
2个月前
已完结
Flip-chip fabrication of nanoscale co-planar embedded electrodes with controlled exposed areas
2个月前
已完结
Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems
2个月前
已完结
Optical interconnections on electrical boards using embedded active optoelectronic components
2个月前
已完结
Facilitating Ultrathin Wafer Handling for TSV Processing
2个月前
已完结
MEMS Materials and Processes Handbook
2个月前
已关闭
Adhesive wafer bonding
2个月前
已关闭
Integration of a temporary carrier in a TSV process flow
2个月前
已完结
Hybrid integration of III-V optoelectronic devices on Si platform using BCB
2个月前
已完结
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