Lv21
142 积分 2024-09-10 加入
Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging
2小时前
已完结
Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
3个月前
已完结
Effect of Grain Structure of Gold Plating Layer on Environmental Reliability of Sintered Ag-Au Joints
3个月前
已完结
Effect of electroplated Au layer on bonding performance of Ag pastes
3个月前
已完结
Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
3个月前
已完结
Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint
3个月前
已完结
Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam
3个月前
已完结
On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters
4个月前
已完结
Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints
4个月前
已完结
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
4个月前
已完结
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