满意的仙人掌
Lv2
106 积分
2023-10-21 加入
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Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions
9天前
已完结
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Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium
9天前
已完结
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Research on Bi contents addition into Sn–Cu-based lead-free solder alloy
14天前
已完结
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Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys
2个月前
已完结
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Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys
2个月前
已关闭
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Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders
3个月前
已完结
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Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations
3个月前
已完结
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Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure
3个月前
已完结
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Effects of Cu, Cu3Sn, Cu6Sn5 on Interfacial Properties between Cu–Sn Alloys and Diamond
3个月前
已完结
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Study on arc characteristics of different defects in pulsed micro-plasma arc welding
3个月前
已完结