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180 积分 2024-06-01 加入
Impact of ALD TiN Capping Layer on Interface Trap and Channel Hot Carrier Reliability of HKMG nMOSFETs
7个月前
已完结
Gate dielectric scaling in MOSFETs device
7个月前
已完结
Overview of ALD applications for advanced CMOS technology
7个月前
已完结
A brief overview of atomic layer deposition and etching in the semiconductor processing
7个月前
已完结
Analysis of Oxygen and Nitrogen Redistribution at Interfaces of HfO2 with Laminate TiN/TiAl/TiN Electrodes
7个月前
已完结
Impact of work function metal stacks on the performance and reliability of multi-V RMG CMOS technology
7个月前
已完结
Characterization of ultra-thin oxides using electrical C-V and I-V measurements
7个月前
已完结
Mechanisms of Silicon Surface Passivation by Negatively Charged Hafnium Oxide Thin Films
7个月前
已完结
Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices
7个月前
已完结
Improvement of Aluminum Diffusion in HKMG Process
7个月前
已完结
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