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20 积分 2023-09-21 加入
Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics
15天前
已完结
Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength
15天前
已完结
Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B
1个月前
已完结
Nanotwinning-assisted structurally stable copper for fine-pitch redistribution layer in 2.5D/3D IC packaging
1个月前
已完结
Characterization of Nanomaterials Using In Situ Liquid-Cell Transmission Electron Microscopy: A Review
1个月前
已完结
New-Style Logic Operation and Neuromorphic Computing Enabled by Optoelectronic Artificial Synapses in an MXene/Y:HfO2 Ferroelectric Memristor
3个月前
已完结
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection
4个月前
已完结
Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)
4个月前
已完结
Investigation on the copper void defect by Transmission Electron Microscope (TEM)
4个月前
已完结
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection
4个月前
已完结
基于“正常”人群子痫前期风险预测模型的建立
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