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170 积分 2023-11-09 加入
Grain effect, creep analysis, and machine learning of Sn-3Ag-0.5Cu solder joint of BGA package under thermal shock test
21小时前
待确认
Dynamic growth mechanism of tin whisker driven by compressive stress under thermal-mechanic-electric-diffusion coupling
3个月前
已完结
Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures
3个月前
已完结
Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration
10个月前
已完结
Effect of Grain Boundaries and Local Variation Influence of Current Density and Temperature on the Electromigration Damage in Gold Thin Films
11个月前
已完结
Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint
1年前
已完结
Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
1年前
已完结
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