Lv3
270 积分 2023-12-14 加入
Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag
5小时前
待确认
Comparative study of thermally conductive fillers in underfill for the electronic components
1个月前
已完结
Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
1个月前
已完结
Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball
1个月前
已完结
Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints
1个月前
已完结
Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires
1个月前
已完结
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
1个月前
已完结
Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages
1个月前
已完结
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP
1个月前
已完结
Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate
4个月前
已完结
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