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50 积分 2024-07-23 加入
Encapsulating Plastic Microelectronics
1个月前
已完结
Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package
1个月前
已完结
A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints
1个月前
已完结
Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage
1个月前
已完结
Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package
1个月前
已关闭
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
1个月前
已完结
Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package
1个月前
已关闭
Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package
1个月前
已关闭
Encapsulating Plastic Microelectronics
2个月前
已完结
Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
4个月前
已完结
Hydrogen Plasma Utilization in Advanced Logic Technology
2个月前
已采纳
Silk fibroin microspheres with photothermal nanocarrier encapsulation for anticancer drug delivery
2个月前
已采纳
Bianisotropy Picture of Higher Permeability at Higher Frequencies
2个月前
已采纳
Clarifying the Origin of Ordering Effect of PtCo Intermetallic Catalysts in Catalyzing Oxygen Reduction
2个月前
已采纳
Hydrothermal synthesis of CeO2 nanoparticles and its application in electrochemical detection of nitrofurantoin antibiotics
2个月前
已采纳
Dual-parameter stretchable, transferable mesh piezoresistive sensor for electronic skin detection of strain and temperature changes
2个月前
已采纳
A nanosecond Q-switched fiber laser based on step-index multimode fiber
2个月前
已采纳
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