Lv1
80 积分 2023-10-04 加入
Low Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance
2个月前
已完结
Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling
2个月前
已完结
Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue
2个月前
已完结
Simplified Open-Loop Transfer Functions to Analyze Influential Parasitic Parameters for Oscillation Caused by Parallel Connected Transistors
4个月前
已完结
Parasitic Inductance Network Modeling Method for Power Module Inner Wirings Based on Inductance Matrix Measurement
4个月前
已完结
Reliability of lead-free solders for die attach in automotive power modules
4个月前
已完结
Simplified Open-Loop Transfer Functions to Analyze Influential Parasitic Parameters for Oscillation Caused by Parallel Connected Transistors
4个月前
已完结
Parasitic Inductance Network Modeling Method for Power Module Inner Wirings Based on Inductance Matrix Measurement
4个月前
已完结
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
7个月前
已完结
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