SciHub
文献互助
期刊查询
一搜即达
科研导航
交流社区
登录
注册
发布
文献
求助
首页
我的求助
捐赠本站
缥缈的一刀
Lv1
50 积分
2023-10-04 加入
最近求助
最近应助
互助留言
Low Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance
15天前
已完结
Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling
1个月前
已完结
Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue
1个月前
已完结
Simplified Open-Loop Transfer Functions to Analyze Influential Parasitic Parameters for Oscillation Caused by Parallel Connected Transistors
2个月前
已完结
Parasitic Inductance Network Modeling Method for Power Module Inner Wirings Based on Inductance Matrix Measurement
2个月前
已完结
Reliability of lead-free solders for die attach in automotive power modules
2个月前
已完结
Simplified Open-Loop Transfer Functions to Analyze Influential Parasitic Parameters for Oscillation Caused by Parallel Connected Transistors
3个月前
已完结
Parasitic Inductance Network Modeling Method for Power Module Inner Wirings Based on Inductance Matrix Measurement
3个月前
已完结
Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
3个月前
已关闭
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
5个月前
已完结
没有进行任何应助
感谢
14天前
感谢
1个月前
感谢
1个月前
感谢
5个月前
感谢
6个月前
感谢
6个月前
感谢
6个月前
感谢
9个月前
缺页,仅有摘要部分
9个月前
感谢
1年前
最近帖子
最近评论
没有发布任何帖子
没有发布任何评论